N200 Wave Soldering Machine

The N200 Wave Soldering Machine is an advanced, high-performance solution designed for automated through-hole PCB soldering. Equipped with dual-wave soldering technology, precision-controlled preheating zones, and an intelligent fluxing system, it ensures consistent solder quality with minimal defects.

Built to support both lead and lead-free soldering processes, the N200 features energy-efficient operation, a nitrogen-compatible environment (optional), and a user-friendly control system. This machine is ideal for high-volume production lines in industries requiring reliable, high-speed, and precise soldering.

N200 Wave Soldering Machine

Product Features

  • Dual-Wave Soldering System – Supports turbulent (chip wave) and smooth (laminar wave) soldering for superior joint quality.
  • Adjustable Conveyor System – Stable transport with adjustable speed, width, and angle for different PCB sizes.
  • Intelligent Preheating Zones – Multi-zone infrared and convection heating for uniform PCB preheating.
  • Automated Spray Fluxing System – Precision-controlled spray fluxer ensures even coating for optimal soldering
  • Lead-Free Compatible – Designed for RoHS-compliant soldering with efficient heat management.
  • Nitrogen-Compatible (Optional) – Reduces oxidation and enhances solder joint quality.
  • User-Friendly Touchscreen Interface – PLC-based intuitive HMI control panel for easy operation and process monitoring.
  • Energy Efficient – Optimized power consumption with low-maintenance design.
  • Advanced Cooling System – Effective cooling zone ensures fast solidification and prevents component damage.

Product Applications

  • Automotive Electronics – ECUs, control modules, and sensor boards.
  • Consumer Electronics – TVs, power supply boards, and home appliances.
  • Industrial Electronics – Power control units, automation systems, and IoT devices.
  • Medical Equipment – High-precision electronic assemblies.
  • Aerospace & Defense – Rugged and high-reliability PCBs.

Technical Parameters

Adjustable width of PCB board Max. 50-260mm
PCB board Transportation height 750 ± 20m
PCB board Transportation speed 0~1200mm/3min
PCB board Transportation angle (soldering inclination) 3~7 degrees
PCB board Transportation direction L→R
Component height limit on PCB board Max. 100mm
Peak height range 0-15 mm adjustable, and keep the peak balance.
Number of peaks 2
Preheating zone length 800mm
Number of preheating zones 1
Preheating zone power 3KW
Preheating zone temperature Room temperature~250 C can be set
heating method Motor hot air
Number of cooling zones 1
cooling method Axial fan cooling
Applicable solder type Lead-free Solder/Ordinary Solder
Tin furnace power 6KW
Dissolved tin in tin furnace 180 kg
Stove temperature Room temperature~300 C, Control accuracy ±1-2 C
temperature control method PID+SSR
Machine control mode Mitsubishi PLC+ touch screen
Flux Capacity Max5.2L
Flux Flow 10~100ml/min
spray method Stepper motor + special small sprinkler for crossing
power supply 3-phase 5-wire system 380V
Starting power (total power) Max. 7kw
normal operating power Approx 2.5kw
Gas source 4~7kg/CM2
Rack size L1800xW1200xH1500mm
Dimensions L2600xW1200xH1500mm
Weight Approx.600kg